As the global demand for high-performance electronic devices continues to surge, the importance of quality and reliability in microelectronics cannot be overstated. These two pillars are critical to the longevity and performance of electronic components, which are foundational to a wide range of industries. This October, IMAPS Germany will once again host its annual conference, providing a vital platform for industry and academia to exchange knowledge on the latest advancements in microelectronic packaging. Mark your calendars for October 17-18, 2024, and join us at the Hochschule München for an engaging and informative event.
Quality and Reliability in Focus
The IMAPS Herbstkonferenz 2024 will delve into several key areas essential to ensuring the quality and reliability of microelectronic devices:
Process Monitoring and Test Strategies
Effective process monitoring and robust test strategies are crucial in identifying and mitigating defects early in the manufacturing cycle. This segment will explore the latest methodologies and tools designed to enhance precision and efficiency in detecting faults, ultimately ensuring higher product reliability.
Testing Systems
Modern testing systems are crucial for ensuring electronic components meet rigorous quality standards. Attendees will learn about innovative testing solutions that provide comprehensive insights into the performance and durability of microelectronic assemblies.
Thermomechanical Reliability
Understanding and improving thermomechanical reliability is vital, particularly as devices become smaller and more complex. This topic will cover the latest research and solutions aimed at addressing the challenges posed by thermal and mechanical stresses, which can significantly impact device performance and lifespan.
Reliability Under Combined Stresses
Microelectronic devices often operate under combined electrical, thermal, and mechanical stresses. Discussions will focus on strategies to predict and enhance reliability in these demanding environments, ensuring that devices can withstand multifaceted operational stresses.
Lifetime Monitoring and Prediction
Accurate lifetime monitoring and prediction are key to preventing unexpected failures and extending the operational life of electronic components. This session will highlight cutting-edge techniques and models used to forecast device longevity and preemptively address potential issues.
Event Details
Date: October 17-18, 2024
Venue: Hochschule München
IMAPS Germany’s annual conference is recognized as a cornerstone for fostering in-depth technical discussions between industry leaders, academic experts, and researchers. This year’s event will feature presentations on a variety of microelectronic packaging topics, offering valuable insights and fostering collaboration.
Meet Our Experts
Representatives Dana Kaufmann and Florian Ottl will be on-site to share their expertise. They will be presenting on the critical topic of semiconductors, showcasing the latest trends and innovations in this pivotal area of microelectronics.
Join the Conversation
We warmly invite you to present your findings and engage in discussions with peers from the industry and academic spheres. Presentations will be 20 minutes long and followed by a discussion session, and participants are encouraged to share their slides with attendees. Take advantage of this excellent opportunity to contribute to the advancement of the microelectronics field and to gain feedback from esteemed colleagues.
For more information and to register, please visit the IMAPS Herbstkonferenz 2024 website.
Ensure your place at the forefront of microelectronics innovation—join us at the IMAPS Herbstkonferenz 2024!
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